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Industry News: Samsung to launch 3D HBM chip packaging service in 2024
SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a technology expected to be introduced for the artificial intelligence chip’s sixth-generation model HBM4 due in 2025, according to ...Read more -
Everything you need to know about PS material properties for the best carrier tape raw material
Polystyrene (PS) material is a popular choice for carrier tape raw material due to its unique properties and formability. In this article post, we will take a closer look at PS material properties and discuss how they affect the molding process. PS material is a thermoplastic polymer used in vari...Read more -
What is carrier tape used for?
The carrier tape is mainly used in the SMT plug-in operation of electronic components. Used with the cover tape, the electronic components are stored in the carrier tape pocket, and form a package with the cover tape to protect the electronic components from contamination and impact. Carrier tape...Read more
