Further Miniaturization and High-Density Placement of Electronic Components
The 0201M (0.25×0.125 mm) component is currently the smallest electronic component in practical use. However, to integrate more functions within the limited space of circuit boards, the mounting density of electronic components will keep rising and will eventually hit a bottleneck. For this reason, the industry has been actively developing the next-generation standard: the 016008M component. The footprint of the 016008M component is roughly half that of the 0201M component, enabling higher-density circuit design.
Leveraging four core control technologies, FUJI has become the first in the world to realize 016008M component mounting.
016008M component captured by a high-resolution camera
FUJI is committed to supplying mounters that deliver high-speed, high-precision and stable placement of ultra-miniature components. This time, through further innovation of four key control technologies, we have achieved the world’s first successful placement of 016008M components on circuit boards.
● Component Posture Recognition During Handling Real-time detection of tilt and posture of ultra-miniature components to achieve optimal component handling.
● High-Precision Component Pick Control Minimize pick offset and electrostatic effects to ensure stable component pickup.
● Ultra-Fine Placement Force Control Precise force regulation to prevent damage to ultra-miniature components caused by placement pressure.
● Ultra-High-Precision Placement Positioning Control Nano-level position correction technology delivers industry-leading placement accuracy.
Comprehensive Solutions for Placement of Next-Generation Ultra-Miniature Components
To mount components smaller than the 016008M size, optimization cannot be limited merely to the placement process. It requires comprehensive optimization across the entire mounting workflow, including circuit board design, solder paste materials, stencils, reflow ovens and inspection.
To embrace the full arrival of the edge AI era, FUJI not only devotes itself to developing advanced mounter technologies, but also continuously deepens collaboration with business partners. Our goal is to build comprehensive solutions covering production and auxiliary materials, and push the competition for electronic component miniaturization onto a new track.
Post time: Oct-05-2026