On August 12, 2026 (local time), NXP Semiconductors, a leading global automotive and industrial semiconductor company, held a groundbreaking ceremony for its new packaging and testing plant in Petaling Jaya, Malaysia.
As a major expansion of its existing testing facility, the project plans to add approximately 500,000 square feet (about 46,500 square meters) of production space, with mass production expected to begin gradually in the first quarter of 2028. Once fully operational, the facility’s designed capacity will double, further enhancing NXP’s self-sufficiency in back-end manufacturing and delivery assurance.
NXP Semiconductors established its back-end manufacturing facility in Petaling Jaya, near Kuala Lumpur, as early as 1972. Over the decades, the facility has evolved into a strategic hub supporting the packaging and testing of microprocessors, microcontrollers (MCUs), mixed-signal, and RF devices.
Once completed, the new factory will expand the facility’s total production area to approximately 900,000 square feet (approximately 83,600 square meters). As a highly automated smart factory, the new plant will be equipped with a fully automated material handling system (AMHS) and advanced quality management technologies, designed to improve quality and efficiency while meeting the increasingly stringent delivery standards of automotive electronics and the Industrial Internet of Things.
The groundbreaking ceremony was attended by many political figures and business executives, including Malaysian Minister of Digital Affairs Gobind Singh Deo and Dutch Ambassador to Malaysia Jacques Werner. Andy Mikalev, Executive Vice President, Chief Operating Officer, and Chief Manufacturing Officer of NXP Semiconductors, stated that Malaysia’s mature semiconductor ecosystem and talent pool have always been key pillars of NXP’s global strategy.
This expansion is an important step in the Group’s deepening of its “hybrid manufacturing strategy,” and by enhancing its testing capabilities, it will effectively strengthen the resilience and responsiveness of its supply chain in the face of global uncertainties.
Post time: Aug-24-2026